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IGBTs Low Thermal Resistance Phase Change Material 0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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IGBTs Low Thermal Resistance Phase Change Material 0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK

IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK
IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK

Large Image :  IGBTs Low Thermal Resistance Phase Change Material 0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC™800Y
Payment & Shipping Terms:
Minimum Order Quantity: 1000PCS
Price: negotiation
Packaging Details: 1000pcs/bay
Delivery Time: 3-5days
Payment Terms: T/T
Supply Ability: 100000pcs/day
Detailed Product Description
Product Name: Phase Changing Materials Color: Yellow
Thermal Conductivity: 0.95 W/mK Phase Transition Temperature: 50℃~60℃
Thickness: 0.127mm~0.25mmT Density: 2.2g/cc
High Light:

thermal insulating materials

,

heat sensitive materials

,

0.95 W/mK Phase Change Material

IGBTs Phase Change Material Heat Sink 0.024℃-in² / W With Low Thermal Resistance

 

Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications.

 

The TIC™800Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

 

     The TIC™800Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 


Features:


>  0.024℃-in² /W thermal resistance
>  Naturally tacky at room temperature, no adhesive required             
>  No heat sink preheating required 


Applications:


>  High Frequency Microprocessors
>  Notebook and Desktop PCs
>  Computer Serves
>  Memory Modules
>  Cache Chips
>  IGBTs

>  Telecommunication 

 

Typical Properties of TIC™800Y Series
Product Name
TICTM803Y
TICTM805Y
TICTM808Y
TICTM810Y
Testing standards
Color
Yellow
Yellow
Yellow
Yellow
Visual
Composite Thickness

 

0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.2g/cc
  Helium  Pycnometer
Work temperature
-25℃~125℃
 
phase transition  temperature
50℃~60℃
 
Thermal conductivity
0.95 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)
0.021℃-in²/W
0.024℃-in²/W
0.053℃-in²/W
0.080℃-in²/W
ASTM D5470 (modified)
0.14℃-cm²/W
0.15℃-cm²/W
0.34℃-cm²/W
0.52℃-cm²/W
 
Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.
 
IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK 0
 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

 

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)