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Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc

Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc
Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc
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Large Image :  Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF™500 Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Detailed Product Description
Tensile Strength: 40 Psi Thermal Conductivity: 2.6 W/m-K
Hardness: 35 Shore 00 Specific Gravity: 2.80 G/cc
Dielectric Constant: 10.2 MHz Fire Rating: 94-V0
High Light:

thermally conductive pad

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thermal conductive material

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Violet Thermal Conductive Pad

Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc

 

 

 The TIF™500 Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF™500 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

 


Features:

>  Good thermal conductive: 2.6 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

 

Typical Properties of TIF™500 Series
Color

Violet

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.48

20mils / 0.508 mm

0.56

Specific Gravity

2.50 g/cc

ASTM D297

30mils / 0.762 mm

0.71

40mils / 1.016 mm

0.80

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

0.91

60mils / 1.524 mm

0.94

Hardness
35 Shore 00 ASTM 2240

70mils / 1.778 mm

1.05 

80mils / 2.032 mm

1.15 

Tensile Strength
 

40 psi

ASTM D412

90mils / 2.286 mm

1.25 

100mils / 2.540 mm

1.34 

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.43   

120mils / 3.048 mm

1.52   

Dielectric Breakdown Voltage
>10000 VAC ASTM D149

130mils / 3.302mm

1.63

140mils / 3.556 mm

1.71

Dielectric Constant
10.2 MHz ASTM D150

150mils / 3.810 mm

1.81

160mils / 4.064 mm

1.89
Volume Resistivity
7.8X10" Ohm-meter ASTM D257

170mils / 4.318 mm

1.98

180mils / 4.572 mm

2.07 

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.14 

200mils / 5.080 mm

2.22 

Thermal conductivity
2.6 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

 

Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.
 
Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc 0
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)