The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
-50 - 180 Continuous Use Temp Acrylic Adhesive Tape with Ceramic Filled Silicone Elastomer The TIA808 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
Heat Sink Thermal Conductive Acrylic Based Adhesive High Bond Strength 10" x 18" Size The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption ... Read More
High Bond Strength Blue Acrylic Thermal Adhesive tape 0.8W/MK Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensivel... Read More
Acrylic Thermal Adhesive Tape For LED Mount Heat Sink Conductive 0.8 W/MK The TIA805FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconducto... Read More
Non Toxic Heatsink Cooling Thermally Conductive Adhesive Transfer Tape with 0.1mm / 0.5mm Thickness The TIA810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Double - Sided Thermal Adhesive Tape , High Voltage Isolation Thermal Conductive Strong Adhesive Tape The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface ... Read More
Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Heatsink Cooling Thermal Insulation Tape Double Sided with Glass Fiber Backing Type 0.8W/mK The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
High Performance Conductive Acrylic 0.9 W/mK Thermal Adhesive Tape TIA 812 with double-sided adhesive The TIA812 Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More