The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
1 mm Thickness easily attached thermal conductive pad with natural adhesive for automotive engine control units The TIF140-18E use a special process, with silicone as the base material, adding thermal ... Read More
New products die cutting in round shape thermal adhesive double side tape fire resistance equate 94 V-0 The TIA605P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Fire resistance thermal acrylic tape TIA610P 1400 g/inch peel adhesion low impedance for replacing heat cure adhesive The TIA610P Series products are mostly used for bonding heat dissipation fins, microprocesso... Read More
-50 - 200 Thermal Conductive Pad , High Speed Mass Storage Drives Thermal Conductive Sheet Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the ... Read More
Power transformers Thermal Conductive Glue , 1.5 g / cc Specific Gravity Heat Conductive Epoxy Glue Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal ... Read More
Potting Coils Thermally Conductive Epoxy Glue , Excellent Insulation Heat Conducting Glue TIE 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy ... Read More
Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Glass Fiber Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA808FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
2.5W / mK Low Viscosity Thermal Conductive Glue with -40 - 130 Service Temperature TIE 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant ... Read More
Heatsink Cooling Thermal Insulation Tape Double Sided with Glass Fiber Backing Type 0.8W/mK The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
