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1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules

1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules
1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF5120-18-11US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thermal Conductivity& Compostion: 1.8W/m-K Color: Grey
Branch Name: ZIITEK Hardness: 20 SHORE00
Application: Wireless Routers Thickness: 3.0mmT
High Light:

20 Shore00 Heat Sink Pad

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Heat Sink Pad 3.0mmT

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1.8W/MK Heat Sink Pad

1.8W/mK 20 shore00 Moldability for complex parts heat sink pad ,3.0mmT for Memory Modules
 
  The TIF5120-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
 
 
TIF500-18-11US Datasheet-REV02.pdf

 

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Features:

>Thickness:3.0mmT
>  Good thermal conductive: 1.8W/mK 

>UL recognized

>Fiberglass reinforced for puncture, shear and tear resistance

>Easy release construction

>Soft and compressible for low stress applications

>Naturally tacky needing no further adhesive coating

>Available in varies thicknesses

>Broad range of hardnesses available

>Moldability for complex parts

 

Applications:

>Automotive electronics

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling

>LED Power Supply

>Rainproof LED Power

>Waterproof LED Power

>SMD LED module

>LED Flesible strip, LED bar

 

 

Typical Properties of TIF™5120-18-11US
Color

Grey

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber *** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity 2.8 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity 1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness   20 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 ps

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp -40 to 160℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage >5500 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant 4.2 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity 1.0X1012 Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating 94 V0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity  1.8  W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Thickness 
 

3.0mmT ***    

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 
1.8W/MK 20 Shore00 Moldability Heat Sink Pad 3.0mmT For Memory Modules 0

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)