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Product Details:
Payment & Shipping Terms:
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| Heat Capacity: | 1 L/g-K | Thermal Conductivity: | 3.0 W/m-K |
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| Hardness: | 12 Shore 00 | Density: | 2.9 G/cc |
| Continuos Use Temp: | -40 To 160℃ | Flame Rating: | 94 V0 |
| High Light: | thermal gap filler 3.0 W/m-K,thermal gap filler for Memory Modules,thermal gap pad For Memory Modules |
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good performance thermal gap filler TIF1100-30-11ES,3.0 W/m-K for Memory Modules
The TIF1100-30-11ES use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-30-11ES-Datasheet-REV02.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:2.5mmT
>hardness:12 shore00
>Colour: gray
>RoHS compliant
>UL recognized
Applications
>Handheld portable electronics
>Semiconductor automated test equipment (ATE)
>CPU
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
>LED Power Supply
>LED Controller
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Typical Properties of TIF1100-30-11ES Series
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Color
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gray
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Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone rubber
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
2.9g/cc
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ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
2.5mmT
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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12 Shore 00
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ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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Outgassing(TML)
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0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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2.9 MHz
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ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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3.0 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ:
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Contact Person: Miss. Dana
Tel: 18153789196
