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Product Details:
Payment & Shipping Terms:
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| Heat Capacity: | 1 L/g-K | Thermal Conductivity: | 3.0 W/m-K |
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| Hardness: | 18 Shore 00 | Density: | 3.0 G/cc |
| Continuos Use Temp: | -40 To 160℃ | Flame Rating: | 94 V0 |
| High Light: | 3 w mk thermal gap filler material,notebook thermal gap filler material,notebook gap pad |
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new type Moldability for complex parts UL recognized 3.0 W/mK thermal conductive pad for notebook,2.5mmT
The TIF1100-30-06US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:2.5mmT
>hardness:18 shore00
>Colour: white
>Easy release construction
>Electrically isolating
>High durability
Applications
>mainboard/mother board
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
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Typical Properties of TIF1100-30-06US Series
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Color
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white
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Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone rubber
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.0g/cc
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ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
2.5mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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18 Shore 00
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ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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Outgassing(TML)
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0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.0 MHz
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ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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3.0 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.
FAQ:
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Contact Person: Miss. Dana
Tel: 18153789196
