The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
Low Thermal Resistance High Heat Insulation Materials , 6W / mK Thin Graphite Sheet TIR600 Series products are high-performance and heat-conductive interface materials with the reasonable prices. They can be ... Read More
Blue 3W Thermally Conductive Putty Gap Filler high viscosity TIF030-05 For Micro Heat Pipe TIF030-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal ... Read More
Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024-in / W The TIC803Y Series is low melting point thermal interface material. At 50, The TIC800Y Series begins to soften and flow, filling ... Read More
Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface ... Read More
Light amber 1.8W Phase Changing materials High Thermal of K10 Thermally pad for Car Battery & Power Supply The TIC800K Series products is a high thermal conduction and dielectric performance insulator pad ... Read More
TIC808A Phase Changing Materials in High Frequency Microprocessors Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal ... Read More
Light amber 1.8W Phase Changing materials High Thermal of K10 Thermally pad for Car Battery & Power Supply The TIC800K Series products is a high thermal conduction and dielectric performance insulator pad ... Read More
0.304mm Thickness IGBT Heatsink Blue Thermal Adhesive Tape with Glass Fiber Backing Acrylic The TIA812 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
The TIA810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low ... Read More
High Performance Conductive Acrylic 0.9 W/mK Thermal Adhesive Tape TIA 812 with double-sided adhesive The TIA812 Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
