The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal ... Read More
TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK The TIF100-20-05S thermally conductive interface materials are applied to fill the air gaps between ... Read More
Pink LCD Heatsink Thermal Conductive Pad 1.5W/mK ,silicone rubber sheet TIF100-15-14S, 60 Shore 00 The TIF100-15-14S Series thermally conductive interface materials are applied to fill the air gaps between the ... Read More
UL recognized Thermal Conductive Pad, grey Silicone sheet 45 Shore 00 1.5W/mK for High speed mass storage drives The TIF100-15-02S Series thermally conductive interface materials are applied to fill the air ... Read More
Grey Cooling Electronic Ultra Soft Thermal Conductive Pad , silicone rubber sheet 1.5w/mk with 60 shore00 hardness The TIF120-15-02F thermally conductive interface materials are applied to fill the air gaps ... Read More
Naturally tacky 1.5 W/mK silicone thermal conductive pad TIF1100-15-10S 45 shore00 for LED controller -50 to 200 The TIF1100-15-10S is a silicone based, thermally conductive gap pad. Its unreinforced constructi... Read More
Pink 3.0W/mK Flexibility Thermal Conductive Pad TIF150-30-49U for Heat Housing at LED-lit 30 shore00, -40 to 160 The TIF150-30-49U thermally conductive interface materials are applied to fill the air gaps ... Read More
3.0 W/MK Silicone Thermal Conductive Pad For Telecommunication Hardware -50 to 200 The TIF150-30-19S thermally conductive interface materials are applied to fill the air gaps between the heating elements and ... Read More
Non Toxic 3.0 g/cc Thermal conductive Pad TIF100-30-11S 3.0W / mK For Micro Heat Pipe 45 shore00 The TIF100-30-11S Series thermally conductive interface materials are applied to fill the air gaps between the ... Read More
CPU Heat Dissipation TIF100-30-05S blue High Thermal Conductive Pad 3.0 g / cc Specific Gravity 3.0W/mK The TIF100-30-05S thermally conductive interface materials are applied to fill the air gaps between the ... Read More
