The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
compressible 1.5w/m.k thermal conductive silicone pad 2.5mmT TIF1100-02F for cooling components to the chassis of frame Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point ... Read More
New type manufatured 1mmT Thermal Conductive Pad Gray White good performance For RDRAM Memory Modules Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface ... Read More
China company supplied Compressible 1.5mmT Gray White Thermally Conductive Pad ultra soft for LED ligh Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... Read More
High cost-effective manufatured 1.5W/M-K Thermal Conductive Pad 45 Shore 00 Outstanding thermal perf For LED Flood Light Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point ... Read More
1.8W/mK, 20 shore00 thermal conductive pad 1.5mmT grey low cost for power supply The TIF560-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer ... Read More
Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc The TIF500 Series is recommended for applications that require a minimum amount of pressure on components. The ... Read More
-50 - 180 Electric Insulation and Thermal Conductive Pads with 1.0W/mK Conductivity TIS112-02 Pink for MOSFETs & IGBTs The TIS112-02 products are the high-efficiency insulation ones with thermal conduction ... Read More
Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant The TIF500S Series thermally conductive interface materials are applied to fill the air gaps between the heating ... Read More
CPU High Thermal Conductivity Silicone CE Gray with 1 l / g -K Heat Capacity The TIF100-15-11S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Read More
2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling The TIF100-15-07E thermally conductive interface materials are applied to fill the air gaps between the heating elements and ... Read More